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Fillgold, established in 2012, is a prominent manufacturer headquartered in the Xinqing Industrial Park, Zhuhai City, Guangdong Province. Over the years, the company has built a solid operational foundation with a sprawling production facility of more than 30,000 square meters and is supported by three wholly-owned subsidiaries, ensuring integrated control over production quality and supply chain efficiency.

30000
M²

Covering over 30,000 square meters with 3 subsidiaries
90

+

More than 90 patents,including 30 invention patents
500

+

Ranked among Guangdong's Top 500 Manufacturing Enterprises (2023)

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These high-precision products are essential to a wide range of advanced industries, such as semiconductor, automotive electronics, telecommunications, computer technology, industrial control systems, power management, and medical equipment.

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Fillgold Factory

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As a certified national high-tech enterprise, the company places strong emphasis on technological innovation and intellectual property development, having accumulated over 90 authorized patents.

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Leadframe Packaging Process: A Comprehensive Technical Overview

Leadframe-based packaging remains one of the most widely adopted technologies in the semiconductor industry, offering a cost-effective solution for protecting integrated circuit dies while providing electrical interconnection to external systems. This document presents a detailed technical exposition of the leadframe packaging process, from wafer preparation through final forming, with emphasis on critical process parameters and quality control methodologies.

06 - 29 2026

IC Substrate Assembly Process: A Comprehensive Technical Overview

IC substrate-based assembly represents a cornerstone of modern semiconductor packaging, offering enhanced interconnection density, superior electrical performance, and design flexibility compared to traditional leadframe approaches. This document presents a detailed technical exposition of the substrate packaging process, with emphasis on Ball Grid Array (BGA) family packages, covering the complete process flow from wafer preparation through final testing and highlighting critical process parameters and quality control considerations.

06 - 29 2026