Products Group

PCB HEATSINK

LID

LEAD FRAME

IC SUBSTRATE

01020304

About Us

Fillgold, established in 2012, is a prominent manufacturer headquartered in the Xinqing Industrial Park, Zhuhai City, Guangdong Province. Over the years, the company has built a solid operational foundation with a sprawling production facility of more than 30,000 square meters and is supported by three wholly-owned subsidiaries, ensuring integrated control over production quality and supply chain efficiency.

30000
M²

Covering over 30,000 square meters with 3 subsidiaries
90

+

More than 90 patents,including 30 invention patents
500

+

Ranked among Guangdong's Top 500 Manufacturing Enterprises (2023)

Factory display

These high-precision products are essential to a wide range of advanced industries, such as semiconductor, automotive electronics, telecommunications, computer technology, industrial control systems, power management, and medical equipment.

Fillgold Company

Fillgold Office

Fillgold Factory

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Fillgold Factory

Fillgold Factory

010203040506

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01020304

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As a certified national high-tech enterprise, the company places strong emphasis on technological innovation and intellectual property development, having accumulated over 90 authorized patents.

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The Difference Between FCBGA and WBBGA

FCBGA (Flip-Chip Ball Grid Array) and WBBGA (Wire Bonded Ball Grid Array) are two distinct chip packaging technologies, differing primarily in bonding processes and bump connection methods.

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FCBGA LID Application Scenarios

The BGA lid (Ball Grid Array package lid) is primarily used in high-performance chip packaging, particularly in Flip-Chip technology, to protect the chip and optimize thermal performance.

11 - 10 2025