CAP
FCBGA CAP refers to Flip Chip Ball Grid Array packaging with a Cap for advanced heat dissipation and reliability, used in high-performance chips like CPUs/GPUs, combining flip-chip technology (direct die-to-substrate connection) with a BGA for efficient thermal and electrical performance, crucial for reducing warpage and managing heat in complex devices.
Products Detail
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Product Features:
High Performance: Enables high-density interconnects and excellent electrical tuning for powerful processors.Superior Thermal Management: The cap and substrate design efficiently moves heat away.Reliability: Reduces stress and warpage, especially important for demanding applications.
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Material:
C1100, C1020, C1010, 6061，6065，5052，MoCu, WCu, etcPlating: Ni.Au.Ag.Sn, etcPlating thickness: Ni: 1.5~6um, Au: 0.05~0.15um, Ag: 0.4~2um, Sn:1.5~3.5um
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Application:
BGA caps are widely used in modern electronics where high performance and efficient thermal management are essential:High-performance computing systems, including servers and workstations.Consumer electronics such as laptops and smartphones.Networking equipment and telecommunications.Automotive and industrial systems subject to demanding conditions.