Etching Lead Frame
An etched lead frame is a critical interconnect component within semiconductor packages, manufactured using a precise photochemical etching process. Unlike traditional stamped lead frames, etching employs chemical agents to selectively remove material from thin metal sheets, forming intricate, high-density patterns with exceptional accuracy.
Products Detail
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Features:
High Precision and Complexity: Capable of producing extremely fine features, tight tolerances (e.g., ±0.025mm), and complex geometries without mechanical stress, burrs, or deformation. This is essential for fine-pitch, multi-row, and lead-on-chip (LOC) designs.Design Flexibility: Rapid prototyping and design changes are easier and less costly, as only digital photomasks need updating instead of hard stamping tools.Material Versatility: Can process a wide range of metals and alloys, including thinner and more delicate materials that are unsuitable for stamping.Cost-Effectiveness for Low/Medium Volumes: Lower initial tooling costs make etching economical for prototyping, pre-production, and medium-volume runs.Stress-Free: The process introduces no mechanical stress or micro-cracks, preserving the material's inherent properties and improving reliability.
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Specs:
Material: C194/C7025/EFTEC-64Thickness: 0.1-0.254mmPlating: AG/NipdAuRoughening
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Application:
Etched lead frames are widely used in advanced semiconductor packages where precision is paramount:High-Density Packages: QFN (Quad Flat No-lead), DFN (Dual Flat No-lead), SON (Small Outline No-lead), and other advanced CSP (Chip Scale Package) formats.Power Devices: Thicker, high-current lead frames for power MOSFETs, IGBTs, and automotive modules.RF & Microwave Packages: Packages requiring precise transmission line structures.MEMS & Sensor Packages: Customized designs for specialized applications.Multi-Row & Complex Arrays: Packages with intricate internal leads and tie bars.