ETSSOP
ETSSOP (Exposed Thin Shrink Small Outline Package) lead frame is an advanced semiconductor packaging component designed for high-density, thermally demanding applications. Combining the thermal advantages of an exposed pad with the space efficiency of a thin, shrunk outline, it enables superior performance in modern compact electronics.
Products Detail
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Features:
Exposed Thermal Pad: Integrated exposed die pad at package bottom for direct PCB thermal connectionUltra-Thin Profile: Reduced package thickness compared to standard TSOP packagesFine Pitch Design: Shrunk lead pitch for increased I/O density in smaller footprint
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Spec:
Pin number: 24L-80LRows: 8RRaw material: AL42/C194/ C192/C7025/EFTEC64LProduct thickness range: 0.127mm/0.152mm/0.203mm/0.254mmPlating: AG/PPF
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Application:
Power Management ICs: Switching regulators, LDOs, power controllersInterface Circuits: USB controllers, signal drivers, transceiversAutomotive Systems: Sensor interfaces, control modules, infotainmentPortable Electronics: Smartphones, tablets, wearable devicesComputing Systems: Memory modules, peripheral controllers