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LID

As computing power TOPS increases, the thermal flux density of SoCs rises sharply, while chip sizes grow progressively. Most chips package use metal lid for heat spreading.
LID is a critical component for protecting the chip and improving heat dissipation.Mainly used for FCBGA and FCCSP package.

4R7A6684-
A7R06987
A7R06993
A7R07007

Products Detail

  • Product Features:

    Efficient heat dissipation: Approximately 90% of the heat from the FCBGA/FCCSP chip is transferred to the external heat sink via the Lid on its top surface, making the Lid's cooling efficiency a key factor in determining the chip's junction temperature. Lid ensures even heat dissipation across the chip surface, minimizing localized overheating risks. 
    Physical protection & Structural Integrity: The Lid provides mechanical resistance to compression, shock, and vibration, while also offering dust and dirt protection, thereby enhancing long-term reliability. 
    Lid adds crucial rigidity to the package, preventing warpage of the large organic substrate during thermal cycling and ensuring the reliability of the solder balls connecting the package to the motherboard.
    Standardization
    It allows for a uniform heatsink mounting height and surface across different processor models, simplifying system design and assembly for manufacturers.

  • Material:

    C1100, C1020, C1010, 6061, 6065, 5052, MoCu, WCu, etc
    Plating: Ni.Au.Ag.Sn,etc
    Plating thickness:Ni: 1.5~6um, Au: 0.05~0.15um, Ag: 0.4~2um, Sn:1.5~3.5um

  • Application:

    Computing & High-Performance Processors:
    Central Processing Units (CPUs): Desktop, server, and workstation CPUs .This is non-negotiable due to extreme power densities (often >100W) and the absolute need for efficient heatsink attachment.
    Graphics Processing Units (GPUs): Discrete graphics cards for PCs and servers employ large, lidded FCBGAs to manage heat from massive dies (often 200W+).
    High-End ASICs & AI Accelerators: AI/ML chips and mining ASICs require robust lidded packaging for thermal management under sustained, intensive workloads.
    Networking & Telecommunications:
    High-Speed Switches & Routers: Core networking chips, SerDes (Serializer/Deserializer) devices, and PHYs handling 400G+ data rates generate significant heat and are packaged in lidded BGAs (often FCBGAs) for reliability in always-on infrastructure.
    FPGAs (Field-Programmable Gate Arrays): Mid-range to high-end FPGAs  almost always come in lidded FCBGA packages. Their programmable nature leads to variable but often high power consumption, necessitating a reliable thermal interface.
    Automotive Electronics (Increasingly Critical):
    Advanced Driver-Assistance Systems (ADAS): The processors for autonomous driving, sensor fusion, and computer vision require lidded packages (often specialized Automotive-Grade FCBGAs) for thermal performance and to withstand harsh environmental vibration and temperature cycling.
    Aerospace, Defense: Applications in extreme environments (wide temperature ranges, high vibration, extended reliability requirements),the lid provides crucial mechanical protection and a stable thermal path.

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