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Engineered for high-performance computing, AI applications, and automotive electronics in the European market.
Advanced organic substrates offering fine-pitch routing for multi-die integration, rivaling silicon interposers in cost-efficiency.
Flip-Chip Ball Grid Array substrates designed for robust thermal management in AI and data center processors.
High-reliability lead frames tailored for Portugal's growing electric vehicle (EV) manufacturing sector.
Innovative thermal dissipation solutions ensuring optimal performance for telecommunications and 5G infrastructure.
Fillgold, established in 2012, is a prominent manufacturer headquartered in the Xinqing Industrial Park, Zhuhai City, Guangdong Province. Over the years, the company has built a solid operational foundation with a sprawling production facility of more than 30,000 square meters and is supported by three wholly-owned subsidiaries, ensuring integrated control over production quality and supply chain efficiency.
Covering area with 3 subsidiaries
Patents, including 30 invention patents
Guangdong's Manufacturing Enterprises (2023)
Marking a significant milestone in its growth trajectory, Fillgold was successfully listed on the New OTC Market in 2022 (Stock Code: 873913). As a certified national high-tech enterprise, the company places strong emphasis on technological innovation and intellectual property development, having accumulated over 90 authorized patents.
It specializes in the research, development, production, and sales of critical electronic components including PCB heatsinks, lead frames, and IC substrates. These high-precision products are essential to a wide range of advanced industries, such as semiconductor, automotive electronics, telecommunications, computer technology, industrial control systems, power management, and medical equipment.
Our technological mastery extends deeply into the realm of Organic Interposers. As Moore's Law faces physical and economic constraints, the semiconductor industry is pivoting towards heterogeneous integration and chiplet-based designs. Our Organic Interposers utilize ultra-fine line routing technologies (L/S down to 2/2 μm) and advanced microvia structures, enabling high-bandwidth communication between distinct silicon dies.
For our partners in Portugal and across Europe, this means access to packaging solutions that mitigate signal loss, enhance power delivery networks (PDN), and provide superior thermal dissipation—crucial for edge computing nodes deployed in Lisbon's smart city initiatives and high-power industrial control systems utilized in Porto's manufacturing hubs.
Tailoring advanced packaging and IC substrate technologies to meet the specific industrial demands of the Portuguese market.
Supplying high-reliability lead frames and thermal-efficient IC substrates for Advanced Driver Assistance Systems (ADAS) and EV battery management systems manufactured in Portugal's prominent automotive zones.
Providing advanced PCB heatsinks and high-frequency Organic Interposers that ensure signal integrity and thermal stability for 5G base stations and telecommunication infrastructure expanding across Lisbon.
Supporting Portugal's green energy transition with robust power management components and substrates designed for solar and wind energy inverters, ensuring long-term durability under high-voltage conditions.
Partnering with innovation hubs in Porto and Braga to supply rapid-prototyping and mass-production of chiplet packaging solutions, empowering local AI and IoT startups to scale globally.
The company’s dedication to excellence and innovation has been consistently recognized through numerous prestigious accolades. Among these are the “Excellent Private Entrepreneurs of Zhuhai,” “The 50 Most Innovative Companies in Guangdong NEEQ,” and the notable inclusion in “The Top 500 Manufacturing Enterprises in Guangdong in 2023.” These honors not only underscore Fillgold's robust capabilities in manufacturing and innovation but also reinforce its influential standing within the industry.
Explore our extensive range of electronic components, substrates, and packaging solutions engineered for the future of technology.
Ultra-thin coreless substrates for mobile and wearable electronics.
High-rigidity substrates with embedded trace technology for CPUs.
Optimized for high-speed data transfer in neural processing units.
Low signal loss materials tailored for radio frequency applications.
Embedded copper coin technology for localized extreme heat dissipation.
Quad Flat No-leads frames for compact, high-performance ICs.
Standard Ball Grid Array solutions for consumer and industrial electronics.
Heavy copper substrates designed for EV power inverters and converters.