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PCB HEAT SINKS

PCB metal heat sinks refer to a sophisticated thermal management technique used in the design and manufacturing of Printed Circuit Boards (PCBs). This process involves embedding solid copper blocks (or coins) into the cavity of a multilayer PCB, where they are laminated and plated to become an integral part of the board's structure.
Provide a direct, low-thermal-resistance path to transfer heat away from high-power components (like CPUs, FPGAs, or power converters) to a heat sink or the opposite side of the board, significantly improving thermal performance.

A7R06968
A7R06979
A7R07026
A7R07029
A7R07042
A7R07046
A7R07050
A7R07056
A7R07066
A7R07069

Products Detail

  • Key Features and Structure

    Construction: A cavity is milled into the core layers of the PCB. A solid copper block, typically thicker than the PCB's standard copper layers, is precisely machined and inserted into this cavity. It is then laminated under heat and pressure with the surrounding prepreg (PP) layers. Through-hole vias are often drilled and plated around or through the block to enhance electrical and thermal connection.

  • Material:

    Material: C1100, C1020, C1010, 6061, 6065，5052, MoCu, WCu, Ceramic etc
    Plating: Ni.Au.Ag.Sn,etc
    Plating thickness: Ni: 1.5~6um, Au: 0.05~0.15um, Ag: 0.4~2um, Sn:1.5~3.5um

  • Types:

    Non-Exposed (Buried): The block is embedded entirely within the board, with standard PCB layers covering it. Heat is transferred through thermal vias to inner planes or external heatsinks.
    Exposed (Flush): The top and/or bottom surface of the copper block is exposed at the PCB's exterior surface. This allows a component's base to be mounted directly onto the block or for a heatsink to be attached with minimal interface resistance.

  • Advantages:

    Superior Thermal Management:  It provides 5-10 times better thermal conductivity than a cluster of thermal vias alone, effectively lowering the component's junction temperature and improving reliability.
    Space Efficiency: Saves space on the PCB surface by reducing or eliminating the need for bulky external thermal bridges or heat spreaders.
    Structural Rigidity: The solid block adds mechanical strength to the board, especially in the area under large ball grid array (BGA) components, reducing the risk of warpage during reflow soldering.
    Power Integrity: Can serve as an excellent low-impedance ground plane or power plane for high-current circuits, reducing voltage drop and improving EMI performance.
    Design Flexibility: Can be customized in shape (round, rectangular) and size to fit specific components.

  • Application:

    High-Power LED Lighting: For managing intense heat from LED arrays.
    Automotive Electronics: In control units (ECUs), power steering, and LED headlights.
    Telecommunications/Networking: Base stations, routers, and switches with high-power ASICs and processors.
    Power Electronics: DC-DC converters, inverters, and motor drives.

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