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QSOP

QSOP (Quarter Small-Outline Package) lead frame is the internal metal skeleton that provides structural support, electrical connectivity, and thermal dissipation for the integrated circuit within the QSOP package. It serves as the critical interface between the semiconductor die and the printed circuit board.

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Products Detail

  • Features:

    Space Efficiency: Significantly saves PCB real estate compared to larger SOP or SOIC packages.
    Weight Reduction: Contributes to lighter end products.
    Performance: Shorter lead lengths can reduce parasitic inductance and capacitance, supporting higher-speed operation.
    Reliability: Robust design ensures stable performance in various applications.

  • Spec:

    Pin number: 8L-28L 
    Rows: 2R 
    Raw material: AL42/C194/ C192/C7025/EFTEC64T
    Thickness: 0.127mm/0.152mm/0.203mm
    Plating: AG/PPF

  • Application:

    Memory modules (Flash, SRAM)
    Microcontrollers
    Communication ICs
    Networking equipment
    Consumer electronics

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