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SSOP

SSOP (Shrink Small Outline Package) is a reduced-footprint version of the standard SOP, enabled by a specialized fine-pitch lead frame. The key innovation lies in its compact lead frame design that allows for higher pin density while maintaining the gull-wing lead configuration for reliable surface mounting.

Products Detail

  • Features:

    Outstanding Space Efficiency
    Excellent Thermal Management
    Superior Electrical Properties
    High-Yield Production
    Economic Efficiency
    RELIABILITY EXCELLENCE
    DESIGN FLEXIBILITY
  • Spec:

    Pin number: 8L-56L 
    Rows: 2R-10R 
    Raw material: AL42/C194/ C192/C7025/EFTEC64T
    Thickness: 0.127mm/0.152mm/0.203mm
    Plating: AG/PPF
  • Application:

    Consumer Electronics: Smartphones, tablets, wearables
    Computing: Memory modules, peripheral controllers
    Automotive: Infotainment, body control modules (qualified grades)
    Industrial: PLCs, motor controllers, sensor interfaces
    Communications: Network switches, routers, base stations

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