TO SERIES
The TO (Transistor Outline) series lead frame is a family of standardized, robust lead frame designs primarily used for packaging power semiconductors and discrete devices. Unlike high-density digital IC lead frames, TO lead frames are engineered for high current handling, efficient heat dissipation, and mechanical ruggedness.
Products Detail
-
Features:
Power-Centric Design: Features a large, central mounting area (often the entire header or tab is part of the lead frame) to accommodate power dies (e.g., MOSFETs, IGBTs, diodes, voltage regulators) and to act as a primary thermal path.Superior Heat Dissipation: The design often integrates an exposed metal pad or tab (e.g., the backside of the TO-220, TO-247 tab) intended for direct attachment to an external heatsink, maximizing thermal performance.High Current Capacity: Uses thicker metal strips and fewer leads (typically 2 to 5 leads, plus the tab) to carry substantial electrical current with minimal resistance.Mechanical Robustness: Constructed from durable materials (like thick copper) to withstand thermal cycling stress and mechanical vibration in demanding applications.
-
Spec:
Pin number: 4L-20LRows: 1R -4RRaw material: AL42/C194/ C192/C7025/EFTEC64TThickness: 0.2-1mmPlating: AG/PPF
-
Application:
TO lead frames are ubiquitous in any application requiring power management, conversion, or control:Power Supplies & Converters (AC/DC, DC/DC)Motor Drives & Industrial ControlsAutomotive Electronics (Engine control units, LED lighting, powertrain)Consumer AppliancesRenewable Energy Systems (Solar inverters, wind turbines)