TOLL
The TO-LL (Thin Small Outline Package - Low Profile) lead frame represents an advanced evolution in power semiconductor packaging. Designed to meet the stringent demands of modern power electronics for miniaturization, high efficiency, and superior thermal performance, the TO-LL series offers a low-profile, surface-mount solution while maintaining the ruggedness and power-handling capabilities of traditional TO packages.
Products Detail
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Features:
Ultra-Low Profile: With a typical package height of ≤ 1.0 mm, TO-LL significantly reduces the vertical footprint compared to standard TO-220 (SMD) or DPAK packages, enabling use in space-constrained applications like ultra-thin power adapters and automotive control units.Exceptional Thermal & Electrical Performance: Despite its small size, the lead frame design maximizes the exposed copper pad area on the bottom. This large thermal pad provides:Very low thermal resistance (Rth(j-a)) for efficient heat dissipation directly into the PCB.Low electrical resistance for reduced power loss and improved current handling.Robust Mechanical Structure: Engineered to withstand the stresses of automotive-grade reliability requirements, including severe thermal cycling and mechanical vibration.
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Spec:
Pin number: 4L-20LRows: 1R -3RRaw material: AL42/C194/ C192/C7025/EFTEC64TThickness: 0.25-0.38mmPlating: AG/PPF
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Application:
TO-LL packages are rapidly becoming the preferred choice for compact, high-efficiency power solutions:Automotive Electronics: Engine Control Units (ECUs), LED lighting drivers, electric power steering, onboard chargers (OBC), and DC-DC converters, where space, weight, and reliability are paramount.Industrial & Consumer Power Supplies: Ultra-slim AC-DC adapters for laptops, TVs, and gaming consoles; server power modules.Telecom & Networking Infrastructure: Point-of-load (POL) converters and voltage regulators on densely populated boards.