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TSSOP

TSSOP (Thin Shrink Small Outline Package) is an ultra-thin variant of the SSOP package family, characterized by a low-profile body height (typically ≤1.1mm) while maintaining the fine-pitch dual-row gull-wing lead configuration. The TSSOP lead frame is specifically engineered to enable this reduced height without compromising mechanical robustness or electrical performance.

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Products Detail

  • Features:

    Proven Reliability: Decades of field performance data
    Excellent Solder Joint Inspectability: Gull-wing leads visible after assembly
    Mechanical Robustness: Withstands PCB bending and thermal stress
    Standardization: Universal design across manufacturers
    Cost Efficiency: Lowest cost per pin among leaded packages

  • Spec:

    Pin number: 8L-56L 
    Rows: 2R 
    Raw material: AL42/C194/ C192/C7025/EFTEC64T
    Thickness: 0.127mm/0.152mm/0.203mm
    Plating: AG/PPF

  • Application:

    TSSOP lead frames are designed for applications demanding high component density and moderate performance.
    Consumer Electronics: Smartphones, tablets, wearables (for memory, power management ICs, audio amps).
    Communication Systems: Network switches, routers, RF modules.
    Automotive Electronics: Infotainment, sensor interfaces (in non-extreme under-hood environments). Note: Special qualification (AEC-Q100) and often copper lead frames with robust finishes are required.
    Industrial Control: PLCs, motor drivers (often in EP variants for thermal performance).

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