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Fillgold, established in 2012 and headquartered in the Xinqing Industrial Park in Zhuhai City, Guangdong Province, has grown into a leading manufacturer specializing in Wafer Level Chip Scale Packaging (WLCSP) technology. With a sprawling production facility covering over 30,000 square meters and supported by three wholly-owned subsidiaries, the company boasts integrated control of production processes, ensuring high quality and efficiency.
Locally in New York, the burgeoning semiconductor manufacturing and advanced electronics sector has driven increased demand for WLCSP solutions. Fillgold is committed to serving this thriving market, providing innovative packaging technologies that support New York's expanding industries such as aerospace, telecommunications, and medical electronics.
Fillgold marked a significant milestone with its successful listing on the New OTC Market in 2022 (Stock Code: 873913). As a certified national high-tech enterprise, Fillgold places strong emphasis on technological innovation and intellectual property development, boasting over 90 authorized patents. The company specializes in R&D, production, and sales of critical electronic components such as PCB heatsinks, lead frames, and IC substrates essential for semiconductor, automotive electronics, telecommunications, computer technology, industrial control, power management, and medical equipment sectors.
In New York's vibrant tech ecosystem, these products underpin critical applications ranging from miniaturized wearable medical devices to 5G communication infrastructure, reflecting the growing importance of wafer-level packaging in enabling smaller, faster, and more efficient electronic systems.
The company’s dedication to excellence and innovation has been consistently recognized through numerous prestigious accolades. Among these are the “Excellent Private Entrepreneurs of Zhuhai,” “The 50 Most Innovative Companies in Guangdong NEEQ,” and the notable inclusion in “The Top 500 Manufacturing Enterprises in Guangdong in 2023.” These honors underscore Fillgold's robust manufacturing capabilities and influential standing within the high-tech electronics industry.
With over a decade of dedicated development, Fillgold has built a reputation for reliability and superior quality. The company has become a trusted, long-term supplier to numerous well-known international corporations. Fillgold provides critical components and robust solutions that meet the stringent requirements of the global market, including advanced semiconductor packaging demands in New York's fast-growing tech and manufacturing sectors.
FLIP CHIP
PCB HEATSINK
LEAD FRAME
IC SUBSTRATE
FBGA
TFBGA
QFN
BGA
TFBGA Extended
Molded Wafer
Test Board
Wafer Level Packaging